Feature

• The acrylic adhesive gives this product an excellent temperature resistance up to 260°C.
• The highly comfortable ultra thin non-woven backing offers excellent converting performance with limited edge picking.
• The temperature resistant glassine liner ensures it can be easily released without adhesive residue left after solder reflow process.
• Sufficient holding power and peel strength even after solder reflow process
• Excellent die-cutting properties and very low oozing due to special backing
• High tensile strength
• High aging resistance
• Conforming to RoHS
• High conformability for uneven surfaces